- Positive Material
Identification(PMI) - Ferrite Content
measurement - PAUT
(Phased Array Ultrasonic Testing) - TOFD
(Time of Flight Diffraction) - Infrared and
Thermal Testing - CR
(Computed Radiography) - Hardness
Test
Infrared and Thermal Testing
Principle and Method
Infrared and Thermal Analysis is a Non-Destructive Testing method that measures infrared radiation energy emitted from sound and defect parts and expresses it as a visible temperature scale image to create a thermal map.
Thermal analysis for defect detection is largely divided into a passive method of using natural heat as it is and an active method of applying artificial heat.
Among them, an active method of maximizing the relative temperature difference between the sound part and the peeling part using a heat source is mainly used.
The biggest advantage of the active method is that the sensitivity of the thermal image is improved, so a clear image of the peeling part can be obtained, and it can be applied at any time regardless of the surrounding environment and time.